Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison.- Chapter 2: Sintered Silver for LED Applications.- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications.- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials.- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint.- Chapter6: Morphological changes in sintered silver due to atomic migration.- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials.- Chapter 8: Sintered Copper : Chemistry, Process and Reliability.- Chapter 9: Transient Liquid Phase Bonding.- Chapter 10: Die attach materials for extreme conditions and harsh environments.

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• Tecnologia dos metais / metalurgia
• Engenharia da fiabilidade
• Dispositivos e materiais electrónicos
• Ensaio de materiais

Sintered silver;Nano-silver sintering;Low temperature joining technology;Lead-free die attach;Power module;Hybrid electric vehicle;Solder solidification;Solder alloys;High temperature alloys;Process control;quality control, reliability, safety and risk