3D Microelectronic Packaging
-15%
portes grátis
3D Microelectronic Packaging
From Fundamentals to Applications
Goyal, Deepak; Li, Yan
Springer International Publishing AG
07/2018
463
Mole
Inglês
9783319830865
15 a 20 dias
724
Descrição não disponível.
Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.
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3D microelectronic packages;Advanced materials in 3D packages;Failure analysis microelectronic packaging;Heat dissipation;Metallic and polymeric packaging materials;Micro bumps;Quality and Reliability of 3D Packaging;Solder connects in 3D packages;TSV Processing and Reliability;Through-silicon via
Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
